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Appendix D - Bill of Materials

Here are the lists of materials that are used for each individual subsystem for the selected design. The materials are categorized according to subsystem for ease of viewing.

Temperature Sensor Materials
TMP1075 Temperature Sensor
CE SMD 0805 .01UF 10% 50V X7R
RES SMD 4.99K OHM 0.1% 1/8W 0805
Pushbutton Switch, SPST, 3A, 250V

 

Humidity Sensor Materials
Humidity, Temperature 0 ~ 100% RH Digital +-1.8% RH, I2C Output
CE SMD 0805 .01UF 10% 50V X7R
RES SMD 4.99K OHM 0.1% 1/8W 0805
4 Position Socket Connector 0.100” (2.54mm) Through Hole Gold
Pushbutton Switch, SPST, 3A, 250V

 

Microcontroller Materials
PIC18LF27K40-I/SO
CE SMD 0805 .01UF 10% 50V X7R
RES SMD 4.99K OHM 0.1% 1/8W 0805
OLED 128x64 1.3” I2C

 

Actuator Materials
IFX9201SGAUMA1 Half Bridge Motor Driver
FAN AXIAL 30X8MM 5VDC
DIODE ZENER 6.2V 500MW SOD123
Aluminum Electrolytic Capacitors - SMD 4V 100uF 20%
0.1 µF ±10% 50V Ceramic Capacitor X7R 0805 (2012 Metric)
1000 pF ±10% 50V Ceramic Capacitor X7R 0805 (2012 Metric)

 

Power System Materials
LM2575-5.0WU
LM2575-3.3WU
BATT CHARGER DESKTOP 3.7V 1A
Dual 18650 Battery Holder
2X USE-18650-2200MAH
1N5822
330uH Inductor
330uF Capacitor
100uF Capacitor

For the spreadsheet that lays out all of the details for each of these materials mentioned, click here

 

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